Home All Products BGA/FPGA devices extrusion aluminum heat sink
Product Attributes
Product Parameters
Type of Shipping Land , Ocean , Air , Express
Shipping Port Shanghai,Ningbo,Shenzhen
Supply Capacity 200000pcs per month
Packaging Method To be packed by EPE paper and carton first,then to be packed by plywood pallet.
Packaging Pictures
Production 200000pcs per month
Country of Origin Suzhou,China
Brand Remgar
Product Details
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BGA/FPGA devices extrusion aluminum heat sink

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